Research Internship for Young Academics (RIYA)
The Ohio State University’s Research Internship for Young Academics (RIYA) program is designed to facilitate cutting-edge research experiences for undergraduate mechanical engineering students from top institutes in India.
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0-week program (from May to July, with some flexibility in the dates)
(Note: Only virtual internships are planned in Summer 2024.)
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Candidates must have completed three years in a recognized mechanical engineering Bachelor of Technology program or a combined bachelor’s/master’s degree program (in a related discipline) to be eligible
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Through a generous gift from the Singh Family Fund and other endowments, each on-campus participant may receive an allowance of $2,500 to $5,000. This funding includes a nominal stipend, housing subsidy and an international travel allowance
(Note: No allowance can be provided to the RIYA scholars in the virtual internship mode while working as volunteers from India.)
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Students’ faculty mentors in India will receive $500 to permit research by their RIYA scholar during the academic year in his/her Indian institution
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Faculty mentors in India who regularly participate in the program are eligible for a travel grant to visit The Ohio State University
This prestigious award provides each student with a rewarding learning experience that will help strengthen his or her knowledge, leadership and research skills. By participating in this unique program, students will develop an understanding of graduate-level studies, which will position them to have a successful career in an academic or industrial research and design (R&D) setting. Most RIYA scholars have pursued master's degrees or doctoral-level studies in renowned U.S. universities or comparable institutions elsewhere after graduation.
Facilities participating in the RIYA program (subject to changes)
- Formal (full) application form (to be provided only to the most promising students)
- Course transcript for the first two or three years
- Two letters of recommendation and a scan of the passport or government-issued ID
Initial application deadline:
October 5, 2023
Deadline to submit the formal application and supplemental materials:
November 15, 2023 ( for qualified applicants)